plas

Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PC 7022E TW3 MITSUBISHI ENGINEERING JAPAN
IUPILON™ 
Medical packaging
Low viscosity,transparent
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--

Plastic Datasheets

thermal performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/7022E TW3
Hot deformation temperature1.8MPa,UnannealedISO 75-2/A114 °C
Linear coefficient of thermal expansionTDISO 11359-26.6E-05 cm/cm/°C
MDISO 11359-26.5E-05 cm/cm/°C
mechanical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/7022E TW3
Bending modulusISO 1782500 Mpa
bending strengthISO 178101 Mpa
Nominal tensile fracture strainISO 527-2>50 %
Tensile modulusISO 527-22700 Mpa
Tensile strainYieldISO 527-26.3 %
tensile strengthYieldISO 527-264.0 Mpa
Electrical performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/7022E TW3
Dielectric strengthIEC 60243-118 KV/mm
Dissipation factor1MHzIEC 602509.7E-03
100HzIEC 602501.7E-03
Relative permittivity100HzIEC 602503.20
1MHzIEC 602503.20
Surface resistivityIEC 600933E+14 ohms
Volume resistivityIEC 60093>1.0E+15 ohms·cm
Physical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/7022E TW3
Melt Volume Flow Rate (MVR)300°C/1.2kgISO 113323.0 cm3/10min
Shrinkage rateMDISO 294-40.60 %
TDISO 294-40.60 %
impact performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/7022E TW3
Impact strength of simply supported beam without notch23°CISO 179/1eUNoBreak