Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
TPO C200F LYONDELLBASELL HOLAND
Hifax
chip、Bag、film、Laminate
High toughness、high definition、Low temperature toughness
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Plastic Datasheets
| Thermal Properties | Test Condition | Test Method | LYONDELLBASELL HOLAND/C200F |
|---|---|---|---|
| Vicat Softening Temperature | ISO306/A50 | 89.0 °C | |
| Heat Deflection Temperature | 0.45MPa,未退火 | ISO75-2/B | 50.0 °C |
| Hardness | Test Condition | Test Method | LYONDELLBASELL HOLAND/C200F |
|---|---|---|---|
| Shore Hardness | 邵氏D | ISO868 | 41 |
| Films Properties | Test Condition | Test Method | LYONDELLBASELL HOLAND/C200F |
|---|---|---|---|
| Film Thickness - Tested) | 50 µm | ||
| Tensile Modulus | MD:50µm,铸造薄膜 | ISO527-3/25 | 125 Mpa |
| Tensile Elongation | MD:屈服,50µm,铸造薄膜 | ISO527-3/500 | 26 % |
| Tensile Stress | TD:屈服,50µm,铸造薄膜 | ISO527-3/500 | 8.00 Mpa |
| Tensile Elongation | TD:断裂,50µm,铸造薄膜 | ISO527-3/500 | 890 % |
| Tensile Stress | MD:断裂,50µm,铸造薄膜 | ISO527-3/500 | 30.0 Mpa |
| TD:断裂,50µm,铸造薄膜 | ISO527-3/500 | 24.0 Mpa | |
| Tensile Elongation | TD:屈服,50µm,铸造薄膜 | ISO527-3/500 | 33 % |
| Tensile Stress | MD:屈服,50µm,铸造薄膜 | ISO527-3/500 | 8.00 Mpa |
| Tensile Modulus | TD:50µm,铸造薄膜 | ISO527-3/25 | 110 Mpa |
| Tensile Elongation | MD:断裂,50µm,铸造薄膜 | ISO527-3/500 | 990 % |
| Physical | Test Condition | Test Method | LYONDELLBASELL HOLAND/C200F |
|---|---|---|---|
| Melt Mass-Flow Rate | 230°C/2.16kg | ISO1133 | 6.0 g/10min |
| Mechanical Properties | Test Condition | Test Method | LYONDELLBASELL HOLAND/C200F |
|---|---|---|---|
| Flexural Modulus | ISO178 | 220 Mpa | |
| Tensile Stress | 屈服 | ISO527-2 | 8.00 Mpa |
| Tensile Strain | 断裂 | ISO527-2 | 500 % |
| Optical | Test Condition | Test Method | LYONDELLBASELL HOLAND/C200F |
|---|---|---|---|
| Gloss | 45°,50.0µm,铸造薄膜 | ASTMD2457 | 47 |
| Haze | 50.0µm,铸造薄膜 | ASTMD1003 | 8.0 % |
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