Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PFA AP-211SH DAIKIN JAPAN
NEOFLON®
Semiconductor molding com、Semiconductor molding com
Weather resistance、Flame retardant
UL
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Plastic Datasheets
| Filling analysis | Test Condition | Test Method | DAIKIN JAPAN/AP-211SH |
|---|---|---|---|
| melt viscosity | 380℃ | No Standard | 2.00E+6 - 2.50E+7 mPa·s |
| physical property | Test Condition | Test Method | DAIKIN JAPAN/AP-211SH |
|---|---|---|---|
| Water absorption rate | 饱和 | ASTM D570 | < 0.010 % |
| Apparent density | JIS K6891 | 1.00 to 1.40 g/cm³ | |
| melt mass-flow rate | 372℃/5.0 kg | ASTM D1238 | 10 to 18 g/10 min |
| Thermal performance | Test Condition | Test Method | DAIKIN JAPAN/AP-211SH |
|---|---|---|---|
| Limiting Oxygen Index | 1.57 mm | ASTM D2863 | > 95 % |
| thermal conductivity | ASTM C177 | 0.26 W/m/K | |
| Linear coefficient of thermal expansion | 20 到 100℃ | ASTM D696 | 0.00012 cm/cm/℃ |
| melting temperature | ASTM D-1523 | 300 to 310 °C | |
| specific heat | No Standard | 1050 J/kg/℃ | |
| UL flame retardant rating | 1.57 mm | UL 94 | V-0 |
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