plas

Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PFA AP-211SH DAIKIN JAPAN
NEOFLON® 
Semiconductor molding compounds,Semiconductor molding compounds
Weather resistance,Flame retardant
UL
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Plastic Datasheets

thermal performanceTest ConditionTest MethodDAIKIN JAPAN/AP-211SH
Extreme Oxygen Index1.57 mmASTM D2863> 95 %
Linear coefficient of thermal expansion20 to 100℃ASTM D6960.00012 cm/cm/℃
Melting temperatureASTM D-1523300 to 310 °C
specific heatNo Standard1050 J/kg/℃
thermal conductivityASTM C1770.26 W/m/K
UL flame retardant rating1.57 mmUL 94V-0
Physical propertiesTest ConditionTest MethodDAIKIN JAPAN/AP-211SH
Apparent densityJIS K68911.00 to 1.40 g/cm³
melt mass-flow rate372℃/5.0 kgASTM D123810 to 18 g/10 min
Water absorption rateSaturationASTM D570< 0.010 %
Filling analysisTest ConditionTest MethodDAIKIN JAPAN/AP-211SH
Melt viscosity380℃No Standard2.00E+6 - 2.50E+7 mPa·s