Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy Plaskon MUF-LFG Cookson Electronics - Semiconductor Products
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Plastic Datasheets
| Mechanical properties | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon MUF-LFG |
|---|---|---|---|
| Flexural modulus | 260°C | ASTM D790 | 0.0686 MPa |
| bending strength | 22°C | ASTM D790 | 0.0132 MPa |
| 260°C | ASTM D790 | 0.00127 MPa | |
| Flexural modulus | 22°C | ASTM D790 | 2.45 MPa |
| flammability | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon MUF-LFG |
|---|---|---|---|
| UL flame retardant rating | 3.2mm | UL 94 | V-0 |
| physical property | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon MUF-LFG |
|---|---|---|---|
| density | ASTM D792 | 2.00 g/cm³ |
| Thermal performance | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon MUF-LFG |
|---|---|---|---|
| thermal conductivity | ASTMC177 | 0.70 W/m/K | |
| Linear coefficient of thermal expansion | MD | ASTM D696 | 9E-06 cm/cm/°C |
| Glass Transition Temperature | ASTME1356 | 135 °C |
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