Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy Quick Patch Devcon
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Plastic Datasheets
| hardness | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| Shore hardness | 邵氏D | ASTM D2240 | 84 |
| Supplementary Information | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| TemperatureResistance-Dry | 93 °C | ||
| Tensile shear adhesion | ASTM D1002 | 17.2 MPa |
| Mechanical properties | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| compressive strength | ASTM D695 | 42.5 MPa | |
| bending strength | ASTM D790 | 33.6 MPa |
| Electrical performance | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| dielectric constant | ASTM D150 | 51.0 |
| thermosetting | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| Thermosetting components | 部件A | 按容量计算的混合比:1.0按重量计算的混合比:1.0 | |
| 储存稳定性(24°C) | 4.0 min | ||
| 部件B | 按容量计算的混合比:1.0按重量计算的混合比:1.0 |
| Uncured Properties | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| Curing Time | 6.0 hr |
| physical property | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| density | 1.86 g/cm³ | ||
| Specific volume | 0.538 cm³/g | ||
| Solid content by volume | 100 % | ||
| Shrinkage rate | MD | ASTM D2566 | 0.10 % |
| Thermal performance | Test Condition | Test Method | Devcon/Quick Patch |
|---|---|---|---|
| Linear coefficient of thermal expansion | MD | ASTM D696 | 5.6E-05 cm/cm/°C |
Contact Us
Get App
Top