Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

LCP E6809T B SUMITOMO JAPAN
--
Laptop case,Electrical components,Coil seal,Spool,Office printer,Automotive parts,Heat resistant cooking utensils
Heat resistance,high strength,Small tolerance,Low molding shrinkage,Good demolding performanc
--
--
--
--
--
--
--
--
--
--
--
--
--
--
--
Plastic Datasheets
thermal performance | Test Condition | Test Method | SUMITOMO JAPAN/E6809T B |
---|---|---|---|
Hot deformation temperature | 1.8 MPa, Unannealed | ASTM D648 | 266 °C |
mechanical properties | Test Condition | Test Method | SUMITOMO JAPAN/E6809T B |
---|---|---|---|
Bending modulus | ASTM D790 | 10400 Mpa | |
bending strength | ASTM D790 | 111 Mpa | |
elongation | Break | ASTM D638 | 5.8 % |
Suspended wall beam without notch impact strength | ASTM D256 | 450 J/m | |
tensile strength | ASTM D638 | 98.0 Mpa |
Physical properties | Test Condition | Test Method | SUMITOMO JAPAN/E6809T B |
---|---|---|---|
Shrinkage rate | MD | ASTM D955 | 0.20 % |
TD | ASTM D955 | 0.65 % | |
Water absorption rate | Saturation | ASTM D570 | 0.020 % |