Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates

LCP E6809T B SUMITOMO JAPAN
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Laptop case,Electrical components,Coil seal,Spool,Office printer,Automotive parts,Heat resistant cooking utensils
Heat resistance,high strength,Small tolerance,Low molding shrinkage,Good demolding performanc
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Plastic Datasheets
| thermal performance | Test Condition | Test Method | SUMITOMO JAPAN/E6809T B |
|---|---|---|---|
| Hot deformation temperature | 1.8 MPa, Unannealed | ASTM D648 | 266 °C |
| mechanical properties | Test Condition | Test Method | SUMITOMO JAPAN/E6809T B |
|---|---|---|---|
| Bending modulus | ASTM D790 | 10400 Mpa | |
| bending strength | ASTM D790 | 111 Mpa | |
| elongation | Break | ASTM D638 | 5.8 % |
| Suspended wall beam without notch impact strength | ASTM D256 | 450 J/m | |
| tensile strength | ASTM D638 | 98.0 Mpa |
| Physical properties | Test Condition | Test Method | SUMITOMO JAPAN/E6809T B |
|---|---|---|---|
| Shrinkage rate | MD | ASTM D955 | 0.20 % |
| TD | ASTM D955 | 0.65 % | |
| Water absorption rate | Saturation | ASTM D570 | 0.020 % |