plas

Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
PA66 A3HGM53 LS BK23189 BASF SHANGHAI
Ultramid®
Laptop case,Industrial machinery,Machine/mechanical components,Shell
High mobility,heat-resisting,Filler: Glass fiber reinf,25% filler by weight,25% filler by weight
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Plastic Datasheets

thermal performanceTest ConditionTest MethodBASF SHANGHAI/A3HGM53 LS BK23189
Hot deformation temperature0.45MPa,UnannealedISO 75-2/B260 °C
1.8MPa,UnannealedISO 75-2/A246 °C
Melting temperatureISO 3146260 °C
mechanical propertiesTest ConditionTest MethodBASF SHANGHAI/A3HGM53 LS BK23189
Bending modulus23°CISO 1787600 Mpa
Tensile modulus23°CISO 527-28500 Mpa
Tensile strainBreak,23°CISO 527-23.0 %
tensile strengthBreak,23°CISO 527-2165 Mpa
Physical propertiesTest ConditionTest MethodBASF SHANGHAI/A3HGM53 LS BK23189
densityISO 11831.32 g/cm³
Water absorption rateEquilibrium,23°C,50%RHISO 621.9 %
Saturation,23°CISO 626.0 %
impact performanceTest ConditionTest MethodBASF SHANGHAI/A3HGM53 LS BK23189
Charpy Notched Impact Strength23°CISO 1797.0 kJ/m²
Impact strength of cantilever beam gap-40°CISO 1806.0 kJ/m²
23°CISO 1807.1 kJ/m²