Material Comparison
Product Info
Product Name
Brand Name
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Properties
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Epoxy Plaskon NXG-1 Cookson Electronics - Semiconductor Products
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Plastic Datasheets
| Mechanical properties | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1 |
|---|---|---|---|
| Flexural modulus | 260°C | ASTM D790 | 0.0686 MPa |
| bending strength | 22°C | ASTM D790 | 0.0125 MPa |
| 260°C | ASTM D790 | 8.14E-04 MPa | |
| Flexural modulus | 22°C | ASTM D790 | 2.55 MPa |
| flammability | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1 |
|---|---|---|---|
| UL flame retardant rating | 3.2mm | UL 94 | V-0 |
| physical property | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1 |
|---|---|---|---|
| density | ASTM D792 | 2.00 g/cm³ |
| Thermal performance | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon NXG-1 |
|---|---|---|---|
| thermal conductivity | ASTMC177 | 0.70 W/m/K | |
| Linear coefficient of thermal expansion | MD | ASTM D696 | 8.9E-06 cm/cm/°C |
| Glass Transition Temperature | ASTME1356 | 140 °C |
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