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PC LDS 3734 MITSUBISHI ENGINEERING JAPAN
IUPILON™ 
Phone,Laser beacon
High mobility
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Plastic Datasheets

thermal performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/LDS 3734
Hot deformation temperature1.8MPa,UnannealedISO 75-2/A120 °C
Linear coefficient of thermal expansionTDISO 11359-26E-05 cm/cm/°C
MDISO 11359-26E-05 cm/cm/°C
Vicat softening temperatureISO 306/B50142 °C
mechanical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/LDS 3734
Bending modulusISO 1782000 Mpa
bending strengthISO 17878.0 Mpa
Nominal tensile fracture strainISO 527-2>50 %
Tensile modulusISO 527-22200 Mpa
Tensile strainYieldISO 527-26.0 %
tensile strengthYieldISO 527-250.0 Mpa
Electrical performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/LDS 3734
Dielectric constant1.00GHzIEC 602503.10
Dissipation factor1.00GHzIEC 602506E-03
Surface resistivityIEC 60093>1.0E+15 ohms
Volume resistivityIEC 60093>1.0E+15 ohms·cm
Physical propertiesTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/LDS 3734
melt mass-flow rate260°C/5.0kgISO 113311 g/10min
Shrinkage rateMDISO 294-40.60 %
Water absorption rateEquilibrium,23°C,50%RHISO 620.35 %
impact performanceTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/LDS 3734
Impact strength of simply supported beam without notch-30°CISO 179/1eUNoBreak
23°CISO 179/1eUNoBreak
Multi axis Instrumented Impact Energy23°C2Internal Method25.0 J
23°CISO 6603-240.0 J
-20°C2Internal Method25.0 J
flammabilityTest ConditionTest MethodMITSUBISHI ENGINEERING JAPAN/LDS 3734
UL flame retardant rating0.40mmIEC 60695-11-10,-20HB

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