Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy EPO-TEK® H21D Epoxy Technology Inc.
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Plastic Datasheets
| Supplementary Information | Test Condition | Test Method | Epoxy Technology Inc./EPO-TEK® H21D |
|---|---|---|---|
| operate temperature | StorageModulus | 5.53 GPa | |
| weight loss on heating | 250°C | 0.060 % | |
| DegradationTemperature | 416 °C | ||
| Shear Strength | 23°C | 23.4 MPa | |
| weight loss on heating | 300°C | 0.17 % | |
| operate temperature | Continuous | -55-250 °C | |
| ThixotropicIndex | 2.60 | ||
| weight loss on heating | 200°C | 0.030 % | |
| operate temperature | Intermittent | -55-350 °C |
| Uncured Properties | Test Condition | Test Method | Epoxy Technology Inc./EPO-TEK® H21D |
|---|---|---|---|
| density | 粘度7(23°C) | 14to20 Pa·s | |
| PartA | 2.44 g/cm³ | ||
| Color | --6 | Silver | |
| --5 | Silver | ||
| density | 储存稳定性 | 900 min | |
| 固化时间(150°C) | 1.0 hr | ||
| PartB | 2.13 g/cm³ |
| thermosetting | Test Condition | Test Method | Epoxy Technology Inc./EPO-TEK® H21D |
|---|---|---|---|
| Thermosetting components | 部件A | 按重量计算的混合比:10 | |
| 贮藏期限(23°C) | 52 wk | ||
| 部件B | 按重量计算的混合比:1.0 |
| Cured Properties | Test Condition | Test Method | Epoxy Technology Inc./EPO-TEK® H21D |
|---|---|---|---|
| Volume resistivity | 23°C | <9.0E-4 ohms·cm | |
| LapShearStrength | 23°C | 10.4 MPa | |
| Shore hardness | ShoreD | 60 |
| physical property | Test Condition | Test Method | Epoxy Technology Inc./EPO-TEK® H21D |
|---|---|---|---|
| Ionic type | NH4+ | 121 ppm | |
| Particle size | <45.0 µm | ||
| Ionic type | Cl- | 64 ppm | |
| Na+ | 72 ppm |
| Thermal performance | Test Condition | Test Method | Epoxy Technology Inc./EPO-TEK® H21D |
|---|---|---|---|
| Glass Transition Temperature | >100 °C | ||
| Linear coefficient of thermal expansion | MD：--3 | 4.2E-05 cm/cm/°C | |
| MD：--4 | 2.3E-04 cm/cm/°C | ||
| MD：导热系数 | 1.0 W/m/K |
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