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Material Comparison

Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy 930 Epoxy Technology Inc.
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Electrical and electronic application fields, printed circuit boards
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Plastic Datasheets

Supplementary InformationTest ConditionTest MethodEpoxy Technology Inc./930
DegradationTemperature350 °C
operate temperatureStorageModulus(23°C)9.06 GPa
Continuous-55-150 °C
Intermittent-55-250 °C
WeightLossonHeating(300°C)0.86 %
Shear Strength23°C11.7 MPa
thermal performanceTest ConditionTest MethodEpoxy Technology Inc./930
Glass transition temperature>90.0 °C
Linear coefficient of thermal expansionMD:导热系数4.6 W/m/K
MD:--31.6E-05 cm/cm/°C
MD:--48.1E-05 cm/cm/°C
thermosettingTest ConditionTest MethodEpoxy Technology Inc./930
Thermosetting components按重量计算的混合比100
Shelf Life(23°C)52 wk
PartB按重量计算的混合比:3.3
Uncured PropertiesTest ConditionTest MethodEpoxy Technology Inc./930
Color--6White
--5Amber
densityPartA1.66 g/cm³
Pot Life360 min
粘度(23°C)>820 Pa·s
固化时间(150°C)1.0 hr
PartB1.02 g/cm³
Physical propertiesTest ConditionTest MethodEpoxy Technology Inc./930
Particle size distribution<500 µm
Cured PropertiesTest ConditionTest MethodEpoxy Technology Inc./930
Dissipation factor1kHz6E-03
LapShearStrength23°C4.54 MPa
Relative permittivity1kHz3.96
Shore hardnessShoreD82
Volume resistivity23°C>2.0E+13 ohms·cm