Material Comparison
Product Info
Product Name
Brand Name
Usages
Properties
Certificates
Epoxy Plaskon SMT-B-2FPI Cookson Electronics - Semiconductor Products
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Plastic Datasheets
| Mechanical properties | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon SMT-B-2FPI |
|---|---|---|---|
| bending strength | 22°C | ASTM D790 | 0.00981 MPa |
| 240°C | ASTM D790 | 0.00196 MPa | |
| Flexural modulus | 240°C | ASTM D790 | 0.147 MPa |
| 22°C | ASTM D790 | 1.37 MPa |
| Electrical performance | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon SMT-B-2FPI |
|---|---|---|---|
| Volume resistivity | ASTM D257 | 1E+15 ohms·cm | |
| dielectric strength | ASTM D149 | 16 kV/mm | |
| dielectric constant | 1kHz | ASTM D150 | 4.00 |
| flammability | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon SMT-B-2FPI |
|---|---|---|---|
| UL flame retardant rating | 3.2mm | UL 94 | V-0 |
| physical property | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon SMT-B-2FPI |
|---|---|---|---|
| density | ASTM D792 | 1.88 g/cm³ |
| Thermal performance | Test Condition | Test Method | Cookson Electronics - Semiconductor Products/Plaskon SMT-B-2FPI |
|---|---|---|---|
| thermal conductivity | ASTMC177 | 0.70 W/m/K | |
| Linear coefficient of thermal expansion | MD | ASTM D696 | 1.7E-05 cm/cm/°C |
| Glass Transition Temperature | ASTME1356 | 210 °C |
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