Material Properties:Terpolymer｜anticaking｜Low extract｜Heat sealing performance｜Easy electroplating｜High gloss｜high definition｜Food contact level
Application Areas:film｜chip
Color:--
Grade:Transparent level

Technical Data Sheet Compare

hardness	Test Condition	Test Method	Test Result
Rockwell hardness	R级	ASTM D785	77
Rockwell hardness	Rockwell hardness	R计秤	ISO 2039-2	77

thermal performance	Test Condition	Test Method	Test Result
Heat Deflection Temperature	0.45MPa,未退火	ASTMD648	75.0 °C
melting temperature		内部方法,ASTMD3418	130 °C

optical performance	Test Condition	Test Method	Test Result
Haze ratio	30.0µm,铸造薄膜	ASTM D1003	<2.0 %

Supplementary Information	Test Condition	Test Method	Test Result
HeatSealTemperature	30.0µm	内部方法	122 °C

Physical properties	Test Condition	Test Method	Test Result
melt mass-flow rate	230°C/2.16kg	ASTMD1238	7.0 g/10min

mechanical properties	Test Condition	Test Method	Test Result
tensile strength	屈服	ASTMD638	22.6 Mpa
elongation	断裂	ASTMD638	>500 %
flexural modulus		ASTMD790	735 Mpa
coefficient of friction	铸造薄膜	内部方法	<1.0

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

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