PC PANLITE® ML6500ZBL TEIJIN JAPAN

237

Unit Price:US$ 4,059 /MT
Packaging Specification:
25 KG/PKG
Packaging Material:
Paper bag
Supply Quantity:
10MT
Delivery Terms:
FOB
Port of Loading :
China Main Port
Accepted Payment Methods:
T/T
Shipping:
Negotiate supplier for shipping details

Supplier Information

ASIA PLASTIC EXCHANGE LIMITED

+86 755 ********View

serv********View

+86 ********View

For more details, please contact the supplier!

Material Description

Material Properties:Thermal stability｜transparent
Application Areas:Casters｜Fitness equipment｜light-emitting diode｜Lighting applications｜Lighting diffuser
Color:--
Grade:Light diffusion level

Technical Data Sheet

optical performance	Test Condition	Test Method	Test Result
transmissivity	3000μm	ASTM D1003	47.0 %

impact performance	Test Condition	Test Method	Test Result
Impact strength of simply supported beam without notch	23°C	ISO 179	NoBreak

flammability	Test Condition	Test Method	Test Result
UL flame retardant rating	0.8mm	UL 94	V-0
	UL flame retardant rating	1.0mm	UL 94	V-0
	UL flame retardant rating	UL flame retardant rating	2.0mm	UL 94	5VB
Hot filament ignition temperature	1.0mm	IEC 60695-2-13	850 °C
Burning wire flammability index	3.0mm	IEC 60695-2-12	960 °C
Burning wire flammability index	Burning wire flammability index	1.0mm	IEC 60695-2-12	930 °C
Hot filament ignition temperature	3.0mm	IEC 60695-2-13	850 °C

mechanical properties	Test Condition	Test Method	Test Result
Tensile modulus		ISO 527-2/1	2400 Mpa
bending strength		ISO 178	98.0 Mpa
Bending modulus		ISO 178	2140 Mpa
Nominal tensile fracture strain		ISO 527-2/50	30 %
Tensile strain	Yield	ISO 527-2/50	6.0 %
tensile strength	Break	ISO 527-2/50	50.0 Mpa
tensile strength	tensile strength	Yield	ISO 527-2/50	64.0 Mpa

thermal performance	Test Condition	Test Method	Test Result
RTI Str	1.5mm	UL 746	130 °C
RTI Imp	1.5mm	UL 746	125 °C
RTI Elec	1.5mm	UL 746	130 °C
Hot deformation temperature	1.8MPa,Unannealed	ISO 75-2/A	127 °C
Linear coefficient of thermal expansion	TD	ISO 11359-2	7E-05 cm/cm/°C
Linear coefficient of thermal expansion	Linear coefficient of thermal expansion	MD	ISO 11359-2	7E-05 cm/cm/°C

Physical properties	Test Condition	Test Method	Test Result
Water absorption rate	23°C,24hr	ISO 62	0.20 %
Shrinkage rate	MD:4.00mm	Internal Method	0.50-0.70 %
Shrinkage rate	Shrinkage rate	TD:4.00mm	Internal Method	0.50-0.70 %
Melt Volume Flow Rate (MVR)	300°C/1.2kg	ISO 1133	2.50 cm3/10min

Electrical performance	Test Condition	Test Method	Test Result
Volume resistivity		IEC 60093	>1.0E+15 ohms·cm
Surface resistivity		IEC 60093	>1.0E+15 ohms

IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.

Get App

Top

PC PANLITE® ML6500ZBL TEIJIN JAPAN

Material Description

Technical Data Sheet Compare

Technical Data Sheet