
PC PANLITE® LV-2250Y BK TEIJIN JAPAN
210
- Unit Price:US$ 3,482 /MT
- Packaging Specification:25 KG/PKG
- Packaging Material:Paper bag
- Supply Quantity:20MT
- Delivery Terms:FOB
- Port of Loading :China Main Port
- Accepted Payment Methods:T/T
- Shipping:Negotiate supplier for shipping details
Supplier Information
ASIA PLASTIC EXCHANGE LIMITED
+86 755 ********View
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For more details, please contact the supplier!
Material Description
- Material Properties:transparent
- Application Areas:Electrical field|Electronic field
- Color:--
- Grade:Injection grade
Material Certification

Technical Data Sheet
other | Test Condition | Test Method | Test Result |
---|---|---|---|
characteristic | 脱膜性良好.中等粘性. | ||
purpose | 电子电气应用领域 |
Mechanical properties | Test Condition | Test Method | Test Result |
---|---|---|---|
elongation at break | ASTM D638/ISO 527 | 140 % | |
Tensile modulus | ASTM D638/ISO 527 | 24464 kg/cm²(MPa)[Lb/in²] | |
Rockwell hardness | ASTM D785 | 77 | |
Flexural modulus | ASTM D790/ISO 178 | 23480 kg/cm²(MPa)[Lb/in²] | |
bending strength | ASTM D790/ISO 178 | 927 kg/cm²(MPa)[Lb/in²] | |
elongation at break | ASTM D638/ISO 527 | 50 % |
Physical properties | Test Condition | Test Method | Test Result |
---|---|---|---|
density | ASTM D792/ISO 1183 | 1.2 | |
Shrinkage rate | ASTM D955 | 0.005-0.007 % | |
Water absorption rate | ASTM D570/ISO 62 | 0.2 % |
Electrical performance | Test Condition | Test Method | Test Result |
---|---|---|---|
Dielectric loss | ASTM D150/IEC 60250 | 3.1 | |
ASTM D150/IEC 60250 | 2.9 |
Thermal performance | Test Condition | Test Method | Test Result |
---|---|---|---|
Heat distortion temperature | ASTM D648/ISO 75 | 288 ℃(℉) | |
vicat | ASTM D1525/ISO R306 | 300 ℃(℉) |
IMPORTANT NOTES: Plas.com collected the data in the data sheet from the material manufacturers. Plas.com makes the best effort to improve the accuracy of the data, but has no responsibility for the data. We strongly recommend verifying the validity of the data with the material manufacturers before making a final decision.
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