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Epoxy H70E-1 Epoxy Technology Inc.
کاربردهای معمول:
Electrical and electronic applications adhesives
توصیف محصول
گواهینامهها(0)
جدول خواص
توصیف محصول
| کاربردهای معمول: | Electrical and electronic applications | adhesives |
گواهینامهها
No Data...
برگه داده فنی
| Cured Properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
|---|---|---|---|---|
| Shore hardness | ShoreD | 88 | ||
| LapShearStrength | 23°C | 12.5 | MPa | |
| Relative permittivity | 1kHz | 4.47 | ||
| Volume resistivity | 23°C | >1.5E+13 | ohms·cm | |
| Dissipation factor | 1kHz | 8.7E-03 | ||
| Uncured Properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| density | 粘度7(23°C) | 24to34 | Pa·s | |
| PartB | 2.37 | g/cm³ | ||
| PartA | 1.63 | g/cm³ | ||
| Color | --6 | Grey.Light | ||
| --5 | Grey | |||
| density | Pot Life | 2900 | min | |
| 固化时间(150°C) | 1.0 | hr | ||
| thermosetting | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Thermosetting components | Shelf Life(23°C) | 26 | wk | |
| PartB | 按重量计算的混合比:1.0 | |||
| PartA | 按重量计算的混合比:1.0 | |||
| thermal performance | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Linear coefficient of thermal expansion | MD：导热系数 | 0.71 | W/m/K | |
| MD：--4 | 1.1E-04 | cm/cm/°C | ||
| MD：--3 | 2.1E-05 | cm/cm/°C | ||
| Glass transition temperature | >80.0 | °C | ||
| Physical properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Particle size distribution | <50.0 | µm | ||
| Supplementary Information | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| weight loss on heating | 250°C | 0.34 | % | |
| 200°C | 0.060 | % | ||
| operate temperature | ThixotropicIndex | 4.92 | ||
| StorageModulus(23°C) | 6.67 | GPa | ||
| Intermittent | -55-300 | °C | ||
| Continuous | -55-200 | °C | ||
| Shear Strength | 23°C | 11.7 | MPa | |
| DegradationTemperature | 450 | °C | ||
| weight loss on heating | 300°C | 1.2 | % |
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