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Epoxy EPO-TEK® TD1001 Epoxy Technology Inc.
کاربردهای معمول:
Adhesive Electrical Electronic Application Fields Adhesive
توصیف محصول
گواهینامهها(0)
جدول خواص
توصیف محصول
| کاربردهای معمول: | Adhesive | Electrical | Electronic Application Fields | Adhesive |
گواهینامهها
No Data...
برگه داده فنی
| Cured Properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
|---|---|---|---|---|
| Dissipation factor | 1kHz | 0.010 | ||
| Shore hardness | ShoreD | 85 | ||
| LapShearStrength | 23°C | >13.8 | MPa | |
| Relative permittivity | 1kHz | 3.12 | ||
| Volume resistivity | 23°C | >2.0E+13 | ohms·cm | |
| Uncured Properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| storage stability | 40000 | min | ||
| Color | White | |||
| density | 1.20 | g/cm³ | ||
| viscosity | 23°C | 10to22 | Pa·s | |
| Curing time | 125°C | >1.0 | hr | |
| thermosetting | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| shelf-life | -40°C | 52 | wk | |
| thermal performance | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Glass transition temperature | >40.0 | °C | ||
| Linear coefficient of thermal expansion | MD：--2 | 5.7E-05 | cm/cm/°C | |
| MD：--3 | 2.1E-04 | cm/cm/°C | ||
| MD：导热系数 | 0.77 | W/m/K | ||
| Supplementary Information | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| DegradationTemperature | TGA | 436 | °C | |
| Shear Strength | 23°C | 35.2 | MPa | |
| operate temperature | Continuous | -55-225 | °C | |
| Intermittent | -55-325 | °C | ||
| StorageModulus(23°C) | 1.98 | GPa | ||
| ThixotropicIndex | 4.10 | |||
| weight loss on heating | 250°C | 0.14 | % | |
| 300°C | 0.44 | % |
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