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Epoxy EPO-TEK® H73 Epoxy Technology Inc.
کاربردهای معمول:
Electrical and electronic applications seals adhesives
توصیف محصول
گواهینامهها(0)
جدول خواص
توصیف محصول
| کاربردهای معمول: | Electrical and electronic applications | seals | adhesives |
گواهینامهها
No Data...
برگه داده فنی
| Cured Properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
|---|---|---|---|---|
| Shore hardness | ShoreD | 91 | ||
| LapShearStrength | 23°C | 13.5 | MPa | |
| Relative permittivity | 1kHz | 5.17 | ||
| Volume resistivity | 23°C | >3.0E+13 | ohms·cm | |
| Dissipation factor | 1kHz | 8E-03 | ||
| Uncured Properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Color | --5 | Amber | ||
| --6 | Grey.Light | |||
| density | PartB | 1.02 | g/cm³ | |
| PartA | 2.02 | g/cm³ | ||
| 粘度7(23°C) | 80to100 | Pa·s | ||
| 固化时间(150°C) | 1.0 | hr | ||
| Pot Life | 150 | min | ||
| thermosetting | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Thermosetting components | 按重量计算的混合比 | 100 | ||
| PartB | 按重量计算的混合比:4.0 | |||
| Shelf Life(23°C) | 52 | wk | ||
| thermal performance | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Glass transition temperature | >100 | °C | ||
| Linear coefficient of thermal expansion | MD：--3 | 3.5E-05 | cm/cm/°C | |
| MD：--4 | 9.8E-05 | cm/cm/°C | ||
| MD：导热系数 | 0.81 | W/m/K | ||
| Physical properties | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Particle size distribution | <50.0 | µm | ||
| Supplementary Information | شرایط آزمون | روش آزمون | نتیجه آزمون | واحد آزمایش |
| Shear Strength | 23°C | 23.4 | MPa | |
| operate temperature | Continuous | -55-250 | °C | |
| Intermittent | -55-350 | °C | ||
| StorageModulus(23°C) | 6.04 | GPa | ||
| weight loss on heating | 200°C | 0.13 | % | |
| 250°C | 0.21 | % | ||
| 300°C | 0.47 | % | ||
| DegradationTemperature | 428 | °C |
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